Display device and manufacturing method thereof

ABSTRACT

A display device includes a first substrate defining a top surface thereof, a bottom surface thereof facing the top surface, and side surfaces thereof connecting the top and bottom surfaces to each other. The side surfaces included: a first side surface defined by: a first patterned surface including a first pattern of which a length thereof extends in a diagonal direction in a plan view of the first patterned surface, and a second patterned surface which extends obliquely from an upper end of the first patterned surface, the second patterned surface including a second pattern of which a length thereof extends in a perpendicular direction from the upper end of the first patterned surface in a plan view of the second patterned surface.

This application claims priority to Korean Patent Application No.10-2016-0032909 filed on Mar. 18, 2016, and all the benefits accruingtherefrom under 35 U.S.C. §119, the content of which in its entirety isherein incorporated by reference.

BACKGROUND

1. Field

The invention relates to a display device and a method for manufacturingthe display device.

2. Description of the Related Art

Importance of display devices has increased with the development ofmultimedia. In response to this situation, various types of displaydevices such as a liquid crystal display device (“LCD”) and an organiclight emitting display device (“OLED”) have been used.

Among them, the liquid crystal display device is one of the most widelyused flat panel display devices, and includes two display substrateswith field generating electrodes such as a pixel electrode and a commonelectrode, and a liquid crystal layer interposed between the two displaysubstrates. The liquid crystal display device generates an electricfield in the liquid crystal layer by applying voltage to the fieldgenerating electrodes, determines the direction of the liquid crystalmolecules of the liquid crystal layer through the electric field andcontrols polarization of incident light with the directed liquid crystalmolecules, thereby displaying an image.

The liquid crystal display device or the organic light emitting displaydevice is formed by laminating one or two or more substrates among thedisplay substrates, but there is a risk of damage to the substrates dueto the impact that may occur during the manufacturing process.Accordingly, there is a situation in which various technical attempts toimprove the strength of the substrate are being performed.

SUMMARY

One or more exemplary embodiment of the invention provides a displaydevice that suppresses cracks generated at an end portion of a substratethereof from growing toward a central portion of the substrate.

One or more exemplary embodiment of the invention provides a displaydevice including a substrate with improved strength.

One or more exemplary embodiment of the invention provides a method formanufacturing a display device that suppresses cracks generated at anend portion of a substrate thereof from growing toward a central portionof the substrate.

One or more exemplary embodiment of the invention provides a method formanufacturing a display device including a substrate with improvedstrength.

One or more exemplary embodiment of the invention provides a method formanufacturing a display device that prevents a light leakage phenomenonthat occurs in an outer portion of a display region thereof.

However, the invention is not restricted to the exemplary embodimentsset forth herein. The above and other features of the invention thathave not been mentioned will become more apparent to one of ordinaryskill in the art to which the invention pertains by referencing thedetailed description of the invention given below.

A display device according to an embodiment of the invention includes afirst substrate defining a top surface thereof, a bottom surface thereoffacing the top surface, and side surfaces thereof connecting the top andbottom surfaces to each other. The side surfaces included: a first sidesurface defined by: a first patterned surface including a first patternof which a length thereof extends in a diagonal direction in a plan viewof the first patterned surface, and a second patterned surface whichextends obliquely from an upper end of the first patterned surface, thesecond patterned surface including a second pattern of which a lengththereof extends in a perpendicular direction from the upper end of thefirst patterned surface in a plan view of the second patterned surface.

An exemplary embodiment of a method for manufacturing a display deviceaccording to the invention includes preparing a first substrateincluding a first side surface defined by first and second patternedsurfaces, and a second substrate which faces the first substrate; andcoupling the first and second substrates to each other to form thedisplay device. The preparing the first substrate includes: providing aninitial state of the first substrate defining a top surface thereof, abottom surface thereof facing the top surface, and connecting surfacesthereof connecting the top and bottom surfaces to each other, forming ata first connecting surface, an upper patterned surface which is inclinedfrom the top surface, the upper patterned surface including a secondpattern of the second patterned surface, a length of the second patternextended perpendicular to a length of the first connecting surface byperpendicularly polishing an upper end of the first connecting surface;forming at the same first connecting surface, a lower patterned surfacewhich is inclined from the bottom surface, the lower patterned surfaceincluding the second pattern of the second patterned surface byperpendicularly polishing a lower end of the first connecting surface;and forming the first patterned surface of the first substrate which isextended from the bottom surface, by diagonally polishing the upper andlower patterned surfaces.

Specific matters of other exemplary embodiments are included in thedetailed description and drawings.

According to the exemplary embodiments of the invention, there are atleast the following effects.

Growth of cracks from at an end surface portion of the substrate towarda center portion of the substrate may be suppressed.

Further, the strength of the substrate at the end surface portionthereof may be improved.

Further effects according to the exemplary embodiments of the inventionare not limited by the contents illustrated above, and further variouseffects are included herein.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other features of the invention will become more apparentby describing in detail exemplary embodiments thereof with reference tothe attached drawings, in which:

FIG. 1 is a partial perspective view of an exemplary embodiment of adisplay device according to the invention;

FIG. 2 is a top plan view of the display device of FIG. 1 according tothe invention;

FIG. 3 is a cross-sectional side view of an exemplary embodiment of thedisplay device according to the invention;

FIG. 4 is an enlarged top plan view of an exemplary embodiment of afirst substrate of the display device according to the invention;

FIG. 5 is an enlarged cross-sectional view of an exemplary embodiment ofa pixel of a display device according to the invention;

FIG. 6 is a cross-sectional side view of first and substrates of thedisplay device according to the invention;

FIG. 7 is a another cross-sectional side view of first and secondsubstrates of the display device according to the invention;

FIG. 8 is an enlarged plan view of an exemplary embodiment of a firstpattern at a side surface of the display device according to theinvention;

FIGS. 9, 9 a and 9 b are enlarged plan views of other exemplaryembodiments of a first pattern at a side surface of the display deviceaccording to the invention;

FIG. 10 is a perspective view of another exemplary embodiment of adisplay device according to the invention;

FIG. 11 is a cross-sectional view of the display device of FIG. 10;

FIG. 12 is a perspective view for explaining an exemplary embodiment ofa process in a method for manufacturing a display device according toinvention;

FIG. 13 is a cross-sectional view for explaining results of the processin FIG. 12 according to the invention;

FIG. 14 is a cross-sectional view for explaining still another exemplaryembodiment of a process in the method for manufacturing the displaydevice according to the invention;

FIG. 15 is a cross-sectional view for explaining the process in FIG. 14according to the invention; and

FIG. 16 is a cross-sectional view for explaining results of the processin FIGS. 14 and 15 according to the invention.

DETAILED DESCRIPTION

The features of the invention and methods for achieving the featureswill be apparent by referring to the exemplary embodiments to bedescribed in detail with reference to the accompanying drawings.However, the invention is not limited to the exemplary embodimentsdisclosed hereinafter, but can be implemented in diverse forms. Thematters defined in the description, such as the detailed constructionand elements, are nothing but specific details provided to assist thoseof ordinary skill in the art in a comprehensive understanding of theinvention, and the invention is only defined within the scope of theappended claims.

The term “on” that is used to designate that an element is on anotherelement or located on a different layer or a layer includes both a casewhere an element is located directly on another element or a layer and acase where an element is located on another element via another layer orstill another element. In the entire description of the invention, thesame drawing reference numerals are used for the same elements acrossvarious figures.

Although the terms “first,” “second” and so forth” are used to describediverse constituent elements, such constituent elements are not limitedby the terms. The terms are used only to discriminate a constituentelement from other constituent elements. Accordingly, in the followingdescription, a first constituent element may be a second constituentelement.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting. As used herein, thesingular forms “a,” “an,” and “the” are intended to include the pluralforms, including “at least one,” unless the content clearly indicatesotherwise. “At least one” is not to be construed as limiting “a” or“an.” “Or” means “and/or.” As used herein, the term “and/or” includesany and all combinations of one or more of the associated listed items.It will be further understood that the terms “comprises” and/or“comprising,” or “includes” and/or “including” when used in thisspecification, specify the presence of stated features, regions,integers, steps, operations, elements, and/or components, but do notpreclude the presence or addition of one or more other features,regions, integers, steps, operations, elements, components, and/orgroups thereof.

Furthermore, relative terms, such as “lower” or “bottom” and “upper” or“top,” may be used herein to describe one element's relationship toanother element as illustrated in the Figures. It will be understoodthat relative terms are intended to encompass different orientations ofthe device in addition to the orientation depicted in the Figures. Forexample, if the device in one of the figures is turned over, elementsdescribed as being on the “lower” side of other elements would then beoriented on “upper” sides of the other elements. The exemplary term“lower,” can therefore, encompasses both an orientation of “lower” and“upper,” depending on the particular orientation of the figure.Similarly, if the device in one of the figures is turned over, elementsdescribed as “below” or “beneath” other elements would then be oriented“above” the other elements. The exemplary terms “below” or “beneath”can, therefore, encompass both an orientation of above and below.

“About” or “approximately” as used herein is inclusive of the statedvalue and means within an acceptable range of deviation for theparticular value as determined by one of ordinary skill in the art,considering the measurement in question and the error associated withmeasurement of the particular quantity (i.e., the limitations of themeasurement system). For example, “about” can mean within one or morestandard deviations, or within ±30%, 20%, 10% or 5% of the stated value.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this disclosure belongs. It willbe further understood that terms, such as those defined in commonly useddictionaries, should be interpreted as having a meaning that isconsistent with their meaning in the context of the relevant art and thepresent disclosure, and will not be interpreted in an idealized oroverly formal sense unless expressly so defined herein.

Exemplary embodiments are described herein with reference to crosssection illustrations that are schematic illustrations of idealizedembodiments. As such, variations from the shapes of the illustrations asa result, for example, of manufacturing techniques and/or tolerances,are to be expected. Thus, embodiments described herein should not beconstrued as limited to the particular shapes of regions as illustratedherein but are to include deviations in shapes that result, for example,from manufacturing. For example, a region illustrated or described asflat may, typically, have rough and/or nonlinear features. Moreover,sharp angles that are illustrated may be rounded. Thus, the regionsillustrated in the figures are schematic in nature and their shapes arenot intended to illustrate the precise shape of a region and are notintended to limit the scope of the present claims.

Hereinafter, exemplary embodiments of the invention will be describedwith reference to the attached drawings.

FIG. 1 is a partial perspective view of an exemplary embodiment of adisplay device according to the invention. FIG. 2 is a top plan view ofthe display device of FIG. 1 according to the invention. FIG. 3 is across-sectional side view of the display device of FIG. 1 according tothe invention. FIG. 4 is an enlarged top plan view of an exemplaryembodiment of a first substrate of the display device according to theinvention. FIG. 5 is an enlarged cross-sectional view of an exemplaryembodiment of a pixel of a display device according to the invention.FIGS. 6 and 7 are cross-sectional side views of first and secondsubstrates of the display device according to the invention. FIG. 8 isan enlarged plan view of an exemplary embodiment of a first pattern of aside surface of the display device according to the invention.

Referring to FIGS. 1 through 8, an exemplary embodiment of a displaydevice according to the invention includes a first substrate 500 havingor defining a first side surface SW1. The first side surface SW1includes or defines a first processed surface GR1 and a second processedsurface GR2 which extends obliquely from an upper end GR1_U of the firstprocessed surface GR1. Hereinafter, surfaces GR1 and GR2 may otherwisebe referred to as a first polished surface and a second polishedsurface, respectively.

First, referring to FIGS. 1 and 2, the first substrate 500 may includeor be formed of a material having heat resistance and permeability. Thefirst substrate 500, for example may include or be formed of, but notlimited to, a transparent glass or plastic.

The first substrate 500 may include or define an upper surface 500_T anda lower surface 500_B that face each other. Further, the first substrate500 may include four side surfaces at the outer circumferences of theupper surface 500_T and the lower surface 500_B. The four side surfaceseach connect the upper surface 500_T and the lower surface 500_B to eachother. The four side surfaces may include the first side surface SW1,and a second side surface SW2 disposed to face the first side surfaceSW1. In an exemplary embodiment, for example, at least a portion of thefirst side surface SW1 and at least a portion of the second side surfaceSW2 may be a plane that is parallel to a y-z plane of FIG. 1. The uppersurface 500_T and the lower surface 500_B may be disposed in a planethat is parallel to an x-y plane.

The first side surface SW1 may include or define the first polishedsurface GR1 and the second polished surface GR2. The first polishedsurface GR1 may face the second side surface SW2, such as being parallelthereto. In an exemplary embodiment in which the second side surface SW2is parallel to the y-z plane, the first polished surface GR1 may beparallel to the y-z plane in the same manner as the second side surfaceSW2. The second polished surface GR2 may be disposed on the firstpolished surface GR1 in a cross-sectional (thickness or z-direction),such as being extended from the first polished surface GR1. The secondpolished surface GR2 may be disposed or formed to be inclined upwardfrom the upper end GR1_U of the first polished surface GR1. That is, thesecond polished surface GR2 may be an inclined surface which forms apredetermined angle with the x-y plane. One of the first and secondpolished surfaces GR1 and GR2 may be extended to define the other one ofthe first and second polished surfaces GR1 and GR2.

The lower end of the second polished surface GR2 may be in contact withthe upper end GR1_U of the first polished surface GR1. That is, thelower end or edge of the second polished surface GR2 may besubstantially the same as that of the upper end GR1_U of the firstpolished surface GR1. Therefore, hereinafter, for convenience ofexplanation, the lower end of the second polished surface GR2 and theupper end GR1_U of the first polished surface GR1 will be represented byGR1_U as the same reference numeral. The upper end GR2_U of the secondpolished surface GR2 may be disposed further toward an inner area of thefirst substrate 500 in comparison with the upper end GR1_U of the firstpolished surface GR1. That is, a distance from the second side surfaceSW2 to the upper end GR2_U of the second polished surface GR2 may besmaller than a distance from the second side surface SW2 to a lower endof the second polished surface GR2, e.g., the upper end GR1_U of thefirst polished surface GR1.

In an exemplary embodiment, the lower end or edge GR1_D of the firstpolished surface GR1 may be in contact with and meet the lower surface500_B of the first substrate 500, and the upper end GR2_U of the secondpolished surface GR2 may be in contact with and meet the upper surface500_T of the first substrate 500. In other words, the first side surfaceSW1 may be made up of only two polished surfaces of the first polishedsurface GR1 and the second polished surface GR2 which define a whole ofthe first side surface SW1.

A first pattern GP1 lengthwise extending in a first direction may beformed on the first polished surface GR1. The first pattern GP1 mayotherwise be referred to a first polished pattern. The first polishedpattern GP1 herein may refer to a unit of patterns or grains disposed orformed on the plane of a surface with a predetermined rule or a group oftwo or more units. Furthermore, the polished pattern may include anintaglio or embossed pattern. That is, the polished pattern may beformed by an intaglio relatively recessed from the plane of the surfaceas compared to the plane of the surface at the periphery of the recessor may be formed by an embossment relatively protruding from the planeof the surface as compared to the plane of the surface at the peripheryof the embossment.

That is to say, the first polished surface GR1 at which the firstpolished pattern GP1 is formed or disposed may be an overall unevensurface having minute concave (e.g., recessed) portions and convex(e.g., embossed) portions. In an exemplary embodiment of manufacturingthe display device, the uneven surface may be caused by a polishingprocess as described later.

The first polished pattern GP1 may be provided in plurality and theplurality of first polished patterns GP1 may be disposed to be spacedapart from one another at constant intervals so as to define the overalluneven surface. In an exemplary embodiment, the first direction in whichthe first polished pattern GP1 lengthwise extends may be a diagonaldirection relative to lengths the planar edges of the plane surface.Referring to FIG. 6, for example, the first direction may be a directionthat is inclined from the upper end GR1_U or the lower end GR1_D of thefirst polished surface GR1 at a constant angle. This may be due to thefact that a diagonal polishing process is applied to the first sidesurface SW1 as will be described later. However, this is an example, andthe invention is not limited by the above-described manufacturingmethod.

The first polished pattern GP1 will be described in more detail withreference to FIG. 8 below.

A second pattern GP2 may be formed or disposed on the second polishedsurface GR2. The second pattern GP2 may otherwise be referred to asecond polished pattern. Similarly to the first polished surface GR1,the second polished surface GR2 may be an overall uneven surface havingminute concave portions and convex portions.

The second polished pattern GP2 may be provided in plurality and theplurality of second polished patterns GP2 may be disposed to be spacedapart from one another at constant intervals so as to define the overalluneven surface. The second polished pattern GP2 may lengthwise extend ina second direction different from the first direction in which the firstpolished pattern GP1 lengthwise extends. In an exemplary embodiment, thesecond direction may be a direction perpendicular to a length of theupper end GR2_U of the second polished surface GR2.

A pad P may be disposed in plurality on the first substrate 500. Theplurality of pads P may be disposed on a non-display region NDA of thefirst substrate 500. The pad P on the first substrate 500 and thenon-display region NDA will be described in detail with reference toFIG. 4 below.

Referring to FIGS. 1 and 2 again, the exemplary embodiment of thedisplay device according to the invention may further include a secondsubstrate 1000 disposed on the first substrate 500.

The second substrate 1000 may be disposed to overlap the first substrate500. An area of the second substrate 1000 may be smaller than that ofthe first substrate 500. Thus, the second substrate 1000 may at leastpartially expose the upper surface 500_T and the first side surface SW1of the first substrate 500. In an exemplary embodiment, the secondsubstrate 1000 overlaps the display region DA of the first substrate 500and may at least partially expose the non-display region NDA of thefirst substrate 500. Further, a plurality of pads P may be disposed on aportion of the non-display region NDA of the first substrate 500 exposedby the second substrate 1000.

The second substrate 1000 may include a first side wall 1000_1 and asecond side wall 1000_2 that face each other. In an exemplaryembodiment, the first side wall 1000_1 may be parallel to the y-z plane.Further, the first side wall 1000_1 may be disposed closer to an innerarea of the display device than the first side surface SW1 of the firstsubstrate 500. In a top plan view, the plurality of pads P may bedisposed between the lower end of the first side wall 1000_1 and theupper end GR2_U of the second polished surface GR2 of the firstsubstrate 500.

In an exemplary embodiment, the first substrate 500 may be a basesubstrate of a thin film transistor (display) substrate of the displaydevice and on which a plurality of thin film transistors of the thinfilm transistor substrate are disposed. The second substrate 1000 may bea base substrate of a color filter (display) substrate of the displaydevice and on which a color filter CF is disposed. The two displaysubstrates coupled to each other to dispose an optical mediumtherebetween, may define a display panel of the display device. Thedisplay panel may display an image with light and the light may beprovided by a separate light source such as a backlight. However, theinvention is not limited thereto, and in another exemplary embodiment,the thin film transistor and the color filter may be both disposed onthe first substrate 500 within a single display substrate of a displaypanel. Further, the display device may be an organic light emittingdisplay device in another embodiment, and in this case, the secondsubstrate 1000 may be a sealing substrate of the display device.

Referring to FIG. 3, the first substrate 500 and the second substrate1000 may be attached to each other by a sealant SLT. That is, thesealant SLT may be interposed between the first substrate 500 and thesecond substrate 1000 to couple the first substrate 500 and the secondsubstrate 1000 to each other. The coupled first and second substrates500 and 1000, along with the various elements of display substratesdisposed thereon, may form a display panel of the display device.

Subsequently, the first substrate 500 will be more specificallydescribed with reference to FIGS. 4 and 5. FIGS. 4 and 5 illustrate anexemplary embodiment of the display device according to the invention asa liquid crystal display device.

The first substrate 500 may include a display region DA and thenon-display region NDA. The display region DA and the non-display regionNDA may define an entirety of the first substrate 500. The displayregion DA is a region in which an image is displayed on the displaydevice. The non-display region NDA is a region in which various signallines are disposed to allow the image to be displayed in the displayregion DA, and where no image is displayed.

The display region DA will be more specifically illustrated. A pixel PX,a gate line GL and a data line DL may be disposed in plurality at thedisplay region DA. In an exemplary embodiment, the plurality of pixelsPX is partitioned by the mutual intersection between the plurality ofdata lines DL and the plurality of gate lines GL, but the invention isnot limited thereto. The plurality of pixels PX may be respectivelyconnected to the plurality of data lines DL and the plurality of gatelines GL. A thin film transistor of the pixel PX may be connected to acorresponding one of the data lines DL and the gate lines GL.

The plurality of pixels PX will be specifically illustrated referring toFIG. 5 below.

A data fan outline DFL for connecting the data line DL and the pad P maybe disposed in the non-display region NDA. The data fan outline DFL maytransmit the signal, which is provided to the pad P, to the data line DLand consequently to the pixel PX.

The plurality of pads P may be disposed on one side of the overallnon-display region NDA. Each of the pads P and the data fan out linesDFL defines a length thereof with is greater than a width thereof. Thepads P may have a relatively greater width than that of the data fanoutline DFL to facilitate the electrical contact with a signal providingdevice such as a printed circuit board (not illustrated). Forconvenience of explanation, a region of the non-display region NDA inwhich the pads P are disposed will be specifically referred to as a padportion PA. In an exemplary embodiment, the pad portion PA does notoverlap the second substrate 1000 and may be disposed between the lowerend of the first side wall 1000_1 of the second substrate 1000 and theupper end of the first side surface SW1 of the first substrate 500.

Next, an exemplary embodiment of the pixel PX disposed in the displayregion DA will be described in detail with reference to FIG. 5.

A gate electrode GE may be disposed on the first substrate 500. The gateelectrode GE may be disposed or formed to protrude from the gate lineGL. A portion of the gate line GL may define the gate electrode GE. Thegate electrode GE may form one of three terminals of a thin filmtransistor, in cooperation with a source electrode SE and a drainelectrode DE which will be described later. The gate electrode GE, thesource electrode SE and the drain electrode DE may each be provided inplurality in the display region DA.

The gate electrode GE and the gate line GL may include or be formed ofone or more of aluminum (Al)-based metal containing aluminum alloy, asilver (Ag)-based metal containing silver alloy, a copper (Cu)-basedmetal containing copper alloy, a molybdenum (Mo)-based metal containingmolybdenum alloy, chromium (Cr), titanium (Ti) and tantalum (Ta).However, these elements are examples, the material of the gate electrodeGE and the gate line GL is not limited thereto, and metal or polymericmaterial having the properties to achieve the desired display device maybe used as material of the gate electrode GE and gate line GL.

A gate insulating film GI may be disposed on the gate electrode GE andthe gate line GL. The gate insulating film GI covers the gate electrodeGE and the gate line GL and may be disposed or formed over an entiretyof the first substrate 500. In an exemplary embodiment of manufacturingthe display device, the gate insulating film GI may be formed by mixingone or more materials selected from an inorganic insulating materialsuch as silicon oxide (SiOx) and silicon nitride (SiNx), and an organicinsulating material such as benzocyclobutene (“BCB”), acrylic basedmaterial and a polyimide. However, these materials are only an example,and the material of the gate insulating film GI is not limited thereto.

A semiconductor pattern layer 700 may be disposed on the gate insulatingfilm GI.

The semiconductor pattern layer 700 may include or be formed ofamorphous silicon or polycrystalline silicon. However, the invention isnot limited thereto, and the semiconductor pattern layer 700 may alsoinclude an oxide semiconductor.

The semiconductor pattern layer 700 may have various shapes in a topplan view such as an island shape and a linear shape. When thesemiconductor pattern layer 700 has a linear shape, the semiconductorpattern layer 700 may be located below the data line DL in across-sectional thickness direction of the display device, to extend tothe top of the gate electrode GE and overlap the gate electrode GE.

In an exemplary embodiment, the semiconductor pattern layer 700 may bepatterned in substantially the same planar shape as data lines DL,source electrodes SE and drain electrodes DE to be described later, inall regions except for a channel section CH of the thin film transistor.

That is to say, the semiconductor pattern layer 700 may be disposed tooverlap entire regions of the data lines DL, the source electrodes SEand the drain electrodes DE except for the channel section CH of thethin film transistor.

The channel section CH may be disposed between the source electrode SEand the drain electrode DE that face each other. The channel section CHis exposed between the source electrode SE and the drain electrode DEthat face each other. The channel section CH serves to electricallyconnect the source electrode SE and the drain electrode DE to eachother, and a specific shape thereof is not limited.

An ohmic contact layer (not illustrated) in which n-type impurity isdoped at a relatively high concentration may be disposed on the top ofthe semiconductor pattern layer 700. The ohmic contact layer may overlapall or a portion of the semiconductor pattern layer 700. However, theohmic contact layer may be omitted in an exemplary embodiment in whichthe semiconductor pattern layer 700 includes an oxide semiconductor.

When the semiconductor pattern layer 700 is an oxide semiconductor, thesemiconductor pattern layer 700 may include or be formed of zinc oxide(ZnO). In addition, one or more ions selected from gallium (Ga), indium(In), stannum (Sn), zirconium (Zr), hafnium (Hf), cadmium (Cd), silver(Ag), copper (Cu), germanium (Ge), gadolinium (Gd), titanium (Ti) andvanadium (V) material may be doped on the semiconductor pattern layer700. As an example, the semiconductor pattern layer 700 as an oxidesemiconductor may include one or more elements selected from ZnO, ZnGaO,ZnInO, ZnSnO, GaInZnO, CdO, InO, GaO, SnO, AgO, CuO, GeO, GdO, HfO,TiZnO, InGaZnO and InTiZnO. However, these elements are only examples,and the types of the oxide semiconductor are not limited thereto.

The data lines DL, the source electrodes SE and the drain electrodes DEmay be disposed on the semiconductor pattern layer 700. The data linesDL, the source electrodes SE and the drain electrodes DE may define adata conductor. The data lines DL, the source electrodes SE and thedrain electrodes DE are in a same layer of the thin film transistorsubstrate among layers thereof on the first substrate 500.

The source electrode SE may diverge from the data line DL in the form ofa branch and may be disposed to extend to the top of the semiconductorpattern layer 700 in the cross-sectional thickness direction of thedisplay device. A portion of the data line DL may define the sourceelectrode SE.

The drain electrode DE is spaced apart from the source electrode SE andmay be disposed at the top of the semiconductor pattern layer 700 in thecross-sectional thickness direction of the display device, and aroundthe gate electrode GE or the channel section CH in the top plan view toface the source electrode SE. The drain electrode DE may be in contactwith and electrically connected to a pixel electrode PE which will bedescribed later.

The data lines DL, the source electrodes SE and the drain electrodes DEmay have a single-layer film structure or a multi-layer film structureincluding or formed of at least one among nickel (Ni), cobalt (Co),titanium (Ti), silver (Ag), copper (Cu), molybdenum (Mo), aluminum (Al),beryllium (Be), niobium (Nb), gold (Au), iron (Fe), selenium (Se) ortantalum (Ta). Further, it is also possible to apply alloys formed byincluding one or more elements selected from titanium (Ti), zirconium(Zr), tungsten (W), tantalum (Ta), niobium (Nb), platinum (Pt), hafnium(Hf), oxygen (O) and nitrogen (N) in the metal. However, theabove-mentioned materials are examples, and the materials of the datalines DL, the source electrodes SE and the drain electrodes DE are notlimited thereto.

Although FIG. 5 illustrates a single thin film transistor is disposed ina single pixel PX, it is a matter of course that the scope of theinvention is not limited thereto. That is, in other exemplaryembodiments, the number of thin film transistors disposed in a singlepixel PX may be a plurality. Further, when a plurality of thin filmtransistors is disposed in a single pixel PX, a single pixel PX may bedivided into a plurality of domains to correspond to the respective thinfilm transistors.

A passivation film PASS may be disposed on the data lines DL, the sourceelectrodes SE, the drain electrodes DE and the semiconductor patternlayer 700. The passivation film PASS may include or be made of aninorganic insulating material or an organic insulating material.

The pixel electrode PE may be disposed on the passivation film PASS. Inan exemplary embodiment, the pixel electrode PE may include or be formedof a transparent conductor such as indium tin oxide (“ITO”) or indiumzinc oxide (“IZO”) or a reflective conductor such as aluminum. The pixelelectrode PE may be provided in plurality in the display region DAand/or in a single pixel PX.

The pixel electrodes PE may have a flat plate shape (e.g., having noopenings or slits) or may have a structure for which one or more slitsis defined. Further, the pixel electrode PE may collectively include twoor more sub-pixel electrodes, and in this case, different voltages maybe respectively applied to the sub-pixel electrodes.

The second substrate 1000 may be disposed to face the first substrate500. The second substrate 1000 may include or be formed of a substancehaving heat resistance and permeability. The second substrate 1000, forexample, may be formed of, but not limited to, a transparent glass orplastic. The second substrate 1000 may include a display region and anon-display region, similar to those of the first substrate 500. Thedisplay region and the non-display region may define an entirety of thesecond substrate 1000. The display region is a region of the secondsubstrate 1000 at which an image is displayed by the display device. Thenon-display region of the second substrate 1000 is a region in which noimage is displayed.

A black matrix BM and a color filter CF may be disposed on the secondsubstrate 1000. The black matrix BM and the color filter CF may beprovided in plurality on the second substrate 1000.

The black matrix BM may be disposed to overlap the gate line GL and/orthe data line DL. Further, the black matrix BM may also overlap a thinfilm transistor.

The black matrix BM may serve to block light incident from outside thedisplay device or prevent light spreading from inside the display deviceto the outside thereof. To this end, the black matrix BM may include orbe formed of a photosensitive resin such as one including a blackpigment. However, this is an example, the material of the black matrixBM is not limited thereto, and any of a number of substances may be usedas a material of the black matrix as long as physical properties thereofblock the light incident from outside the display device.

The color filter CF may be disposed in a portion of the display devicethat is not covered or overlapped by the black matrix BM, namely, aportion exposed by the black matrix BM. The color filter CF mayrepresent various display colors by changing a wavelength of lighttransmitted by a backlight (not illustrated) which provides light todisplay substrates of a display panel. In an exemplary embodiment, thecolor filter CF may include a red color filter, a green color filter anda blue color filter, but the invention is not limited thereto.

An overcoat film OC may be disposed on the black matrix BM and the colorfilter CF. The overcoat film OC is a flattening film and may be disposedover an entirety of the second substrate 1000.

A common electrode CE may be disposed on the overcoat film OC. A commonvoltage may be applied to the common electrode CE. When differentvoltages are respectively applied to the common electrode CE and thepixel electrode PE, an electric field may be formed between the commonelectrode CE and the pixel electrode PE.

A liquid crystal layer LC in which a plurality of liquid crystalmolecules is arranged may be disposed between the first substrate 500and the second substrate 1000 with respective elements thereon. Theliquid crystal layer LC may be controlled by the electric field formedbetween the common electrode CE and the pixel electrodes PE. Thus lightused to display images is controlled by controlling the movement of theliquid crystal disposed in the liquid crystal layer LC.

Next, exemplary embodiments of the side surfaces of the display devicewill be more specifically described with reference to FIGS. 6, 7 and 8.

FIG. 6 is a cross-sectional side view in which a first side surface SW1of the display device of FIG. 1 is viewed in a normal direction of they-z plane.

Referring to FIG. 6, the first polished surface GR1 having the firstpolished pattern GP1, the second polished surface GR2 having the secondpolished pattern GP2 and the first side wall 1000_1 of the secondsubstrate 1000 may be sequentially arranged in the thickness direction(z-direction) of the display device.

Since the first polished pattern GP1 and the second polished pattern GP2are substantially the same as described above, the detailed descriptionthereof will not be provided.

In an exemplary embodiment, the first side wall 1000_1 of the secondsubstrate 1000 may be a surface that is un-processed, for example, hasnot been polished. That is, according to an exemplary embodiment ofmanufacturing the display device, the first side wall 1000_1 of thesecond substrate 1000 may be a surface of an initial state of the secondsubstrate 1000 that is not machined, but the invention is not limitedthereto.

In another exemplary embodiment, the first side wall 1000_1 of thesecond substrate 1000 may be a polished surface such as a result of aninitial state thereof being processed or machined in an exemplaryembodiment of manufacturing the display device.

FIG. 7 is a cross-sectional side view in which a second side surface SW2of the display device of FIG. 1 is viewed in a normal direction of they-z plane.

Referring to FIG. 7, the second side surface SW2 and the second sidewall 1000_2 may be sequentially disposed in the thickness direction(z-direction) of the display device. In an exemplary embodiment, thesecond side surface SW2 and the second side wall 1000_2 may be alignedwith each other, such as being coplanar with each other in a planeparallel to the y-z plane. Further, the same (polished) pattern may bedisposed or formed on each of the second side surface SW2 and the secondside wall 1000_2. Referring to FIG. 7, for example, the same firstpolished pattern GP1 as that disposed at the first polished surface GR1may be disposed or formed at the second side surface SW2 and the secondside wall 1000_2. That is, a diagonal polished pattern may be formed, asillustrated by the diagonal lines in FIG. 7. In an exemplary embodimentof manufacturing the display device, the diagonal polished pattern maybe formed by applying a diagonal polishing process to the second sidesurface SW2 as it will be described later.

Subsequently, the first polished pattern GP1 will be more specificallydescribed with reference to FIG. 8.

The first polished pattern GP1 may define a length thereof greater thana width thereof. The length of the first polished pattern GP1 extends tobe inclined to the upper end GR1_U or the lower end GR1-D of the firstpolished surface GR1, such as at a constant angle with respect to alength of the upper end GR1_U or the lower end GR1-D of the firstpolished surface GR1. In an exemplary embodiment, a single firstpolished pattern GP1 may form a first angle θ1 with the lower end GR1_Dof the first polished surface GR1, and an adjacent first polishedpattern GP1 may form a second angle θ2 with the lower end GR1_D of thefirst polished surface GR1. In an exemplary embodiment, the first angleθ1 and the second angle θ2 may be identical to each other. That is, inan exemplary embodiment, the plurality of first polished patterns GP1which are parallel to each other may be disposed at the first polishedsurface GR1.

In an embodiment, the first angle θ1 may be an acute angle taken in acounter-clockwise direction from the lower end GR1_D. More specifically,in the counter-clockwise direction, the first angle θ1 may be about 50degrees or less and about 0 degree or more with respect to the length ofthe upper end GR1_U or the lower end GR1-D of the first polished surfaceGR1. As the first angle θ1 comes closer to 0 degree, the strength of thefirst substrate 500 may be enhanced.

When performing various processes for manufacturing the display device,fine cracks may occur at an end portion or surface of a substrate. Also,once the cracks initially occur, such cracks may grow away from outersurfaces and toward the inside of the substrate to damage the centralportion of the substrate. To reduce or effectively prevent thissituation, a polishing process is applied to the substrate, at portionswhere cracks may form. That is, the polishing of the first substrate 500is a process employed to reduce or effectively prevent a situation inwhich the cracking of the end portion or surface of the first substrate500 proceeds and grows toward the inside of the first substrate 500. Itis possible to more effectively reduce or effectively prevent crackingof the end portion from proceeding toward the inside of the firstsubstrate 500, as mentioned above, when the angle is applied to thepolishing, e.g., when a length of the first polished pattern GP1 extendsinclined as the diagonal line.

In an exemplary embodiment, the distance between the adjacent firstpolished patterns GP1 may be identical to each other. That is, asillustrated in FIG. 8, d1 and d2 may be identical to each other.

Although the description has been given of a case where the firstpolished pattern GP1 is formed over the entire surface of the firstpolished surface GR1 above, the invention is not limited thereto, andthe first polished pattern GP1 may also be partially formed on the firstpolished surface GR1.

Hereinafter, a display device according to another embodiment of theinvention will be described. In the following examples, the sameconfigurations as described above will be denoted by the same referencenumbers, and the repeated description will be omitted or simplified.

FIG. 9 is an enlarged plan view of another exemplary embodiment of afirst pattern at a side surface of the display device according to theinvention.

Referring to FIG. 9, in another exemplary embodiment of the displaydevice according to the invention, the distances between the firstpolished patterns GP1 of the side surface may be different from eachother. That is, as illustrated in FIG. 9, d1 and d2 may be differentfrom each other. In an exemplary embodiment of manufacturing the displaydevice, the different distances may be formed by changes in the movementspeed of the polishing wheel as will be described later.

FIG. 9a is an enlarged plan view of still another exemplary embodimentof a first pattern at a side surface of the display device according tothe invention.

Referring to FIG. 9a , in still another exemplary embodiment of thedisplay device according to the invention, the diagonal direction of thefirst polished pattern GP1_a may be a direction that intersects with thediagonal direction of the first polished pattern GP1 of FIG. 8.

That is to say, the first polished pattern GP1 of FIG. 8 is aright-to-left diagonal direction from the upper end GR1_U of the firstpolished surface GR1. In contrast, the diagonal direction of the firstpolished pattern GP1_a in FIG. 9a may be a left-to-right diagonaldirection from the upper end GR1_U of the first polished surface GR1.

In an exemplary embodiment of manufacturing the display device, thedirection of the diagonal of the first polished pattern may bedetermined depending on the rotational direction of the polishing wheelthat performs the diagonal polishing. That is, the polishing wheel forperforming the diagonal polishing may rotate in a clockwise direction ora counterclockwise direction, and the first polished pattern GP1 in theleft-to-right diagonal direction or the right-to-left diagonal directionmay be formed on the first polished surface GR1 depending on therotational direction of the polishing wheel.

FIG. 9b is an enlarged plan view of yet another exemplary embodiment ofa first pattern at a side surface of the display device according to theinvention.

Referring to FIG. 9b , in yet another exemplary embodiment of thedisplay device according to the invention, a first polished surface GR1may include a first polished pattern GP1_a extending in theleft-to-right diagonal direction and a first polished pattern GP1extending in the right-to-left diagonal direction.

In an exemplary embodiment, a portion of the same first polished surfaceGR1 may include a first polished pattern GP1_a extending in theleft-to-right diagonal direction from the upper end GR1_U of the firstpolished surface GR1, and the other portion may include a first polishedpattern GP1 extending in the right-to-left diagonal direction from theupper end GR1_U of the first polished surface GR1.

Further, although FIG. 9b illustrates the first polished pattern GP1_ain plural extending in the left-to-right diagonal direction from theupper end GR1_U of the first polished surface GR1 and the first polishedpattern GP1 in plural extending in the right-to-left diagonal directionfrom the upper end GR1_U of the first polished surface GR1, eachdisposed to be spaced apart from and not overlapping each other, theinvention is not limited thereto, and both may at least partiallyoverlap in another exemplary embodiment.

First polished patterns extended in different direction overlapping eachother may be due to changes in the rotational direction of the polishingwheel changes during the diagonal polishing process in an exemplaryembodiment of manufacturing the display device. However, this is anexample and it is a matter of course that the structural features of theinvention are not limited by the manufacturing method.

FIG. 10 is a perspective view of another exemplary embodiment of adisplay device according to the invention. FIG. 11 is a cross-sectionalside view of the display device of FIG. 10.

Referring to FIGS. 10 and 11, the display device may be a curved displaydevice or a curved display panel.

The display device may include a first substrate 500 a and a secondsubstrate 1000 a each bent, while having a constant curvature.

The first substrate 500 a may include a first side surface SW1 and asecond side surface SW2 which is opposite to the first side surface SW1and having a first polished surface GR1 and a second polished surfaceGR2, such as described in FIG. 1. Similarly, the second substrate 1000 amay include a first side surface 1000_1 and a second side surface 1000_2which is opposite to the first side surface 1000_1 and having a polishedsurface, such as described for 1000_2 in FIG. 7. Since the first sidesurface SW1 and the second side surface SW2 of the first substrate 500 aand the first side surface 1000_1 and the second side surface 1000_2 ofthe second substrate 1000 a are substantially the same as thosedescribed in the embodiment of FIG. 1, the detailed description thereofwill not be provided.

When the first substrate 500 a and the second substrate 1000 a are bent,stress due to the bending may be generated, and thus, force in whichcracking of the end portion or surface of the respective proceeds towardthe inside of the substrate may increase. As described above, when thefirst side surface SW1 and the second side surface SW2 of the bent firstsubstrate 500 a includes the polished surface, progression of suchcracks may be reduced or effectively prevented, and thus, stability ofstrength of the bent first substrate 500 a may be improved. Similarly,when the first side surface 1000_1 and/or the second side surface 1000_2of the second substrate 1000 a includes the polished surface,progression of cracks may be reduced or effectively prevented, and thus,stability of strength of the bent second substrate 1000 a may beimproved.

Hereinafter, exemplary embodiments of a method for manufacturing adisplay device according to the invention will be described. Some of theconfigurations to be described below are the same as the configurationsof the liquid crystal display device described above, and in order toavoid the repeated description, the description of some configurationsmay not be provided.

FIG. 12 is a perspective view for explaining an exemplary embodiment ofa process in a method for manufacturing a display device according tothe invention. FIG. 13 is a cross-sectional view for explaining resultsof the process in FIG. 12 according to the invention. FIG. 14 is across-sectional view for explaining still another exemplary embodimentof a process in the method for manufacturing the display deviceaccording to the invention. FIG. 15 is a cross-sectional view forexplaining the process in FIG. 14 according to the invention. FIG. 16 isa cross-sectional view for explaining results of the process in FIGS. 14and 15 according to the invention.

Referring to FIGS. 12 through 16, an exemplary embodiment of the methodfor manufacturing the display device according to the invention includesan operation of preparing a first substrate 500 having a first sidesurface SW1 and a second substrate 1000 which faces the first substrate500. The preparing of the first substrate 500 includes for an initialstate thereof, an operation of perpendicularly polishing the upper endof the first side surface SW1 to form a first upper polished surfaceGR_U, an operation of perpendicularly polishing a lower end of the firstside surface SW1 to form a first lower polished surface GR_D, and anoperation of diagonally polishing the first side surface SW1 to finallyform first and second polished surfaces GR1 and GR2 of the firstsubstrate 500.

First, the operation of preparing the first substrate 500 having thefirst side surface SW1 and the second substrate 1000 which faces thefirst substrate 500 is performed.

The first substrate 500 and the second substrate 1000 may besubstantially identical to those described in the exemplary embodimentsof the display device according to the invention. Therefore, thedetailed description thereof will not be provided.

Subsequently, for the initial state of the first substrate 500, theoperation of perpendicularly polishing the upper end of the first sidesurface SW1 to form an upper polished surface GR_U may be performed withreference to FIG. 12. The terms will be defined for the convenience ofdescription. In the method for manufacturing the display deviceaccording to the invention, polishing may be performed by a polishingdevice that includes polishing wheels WH1, WH2, WH3 and WH4 each havinga main machining surface MS and a sub-machining surface SS, and rotaryshafts R1, R2, R3 and R4 with which the polishing wheels WH1, WH2, WH3and WH4 and rotated respectively.

The main machining surface MS refers to a surface made up of a surfaceparallel to the rotary shafts R1, R2, R3 and R4, and the sub-machiningsurface SS refers to a surface perpendicular to the rotary shafts R1,R2, R3 and R4. That is, an outer circumference of the main machiningsurface MS may have a circular form that surrounds or is concentric withthe respective rotary shaft.

The perpendicular (e.g., vertical) polishing refers to polishing usingthe main machining surface MS, and when performing the verticalpolishing, a polished pattern in the vertical direction may be formed onan object which is machined by the vertical polishing.

The diagonal polishing refers to polishing using the sub-machiningsurface SS, and when performing the diagonal polishing, a polishedpattern in the diagonal direction may be formed on an object which ismachined by the diagonal polishing.

This configuration will be described with reference to FIG. 13. When theperpendicular (vertical) polishing is performed at the upper end of thefirst side surface SW1, the upper polished surface GR_U may be formed asa portion of the first side surface SW1. Similarly to the secondpolished surface GR2 described in the exemplary embodiments of thedisplay device according to the invention described above, the secondpolished pattern GP2 may be formed on the upper polished surface GR_U.In an exemplary embodiment, a length of the second polished pattern GP2may extend in a direction perpendicular to a length of the rotary shaftR1 in FIG. 12 or in a direction perpendicular to the upper end GR_U1 ofthe upper polished surface GR_U.

Subsequently, an operation of perpendicularly polishing the lower end ofthe first side surface SW1 to form a lower polished surface GR_D may beperformed. When the vertical polishing is performed at the lower end ofthe first side surface SW1, a lower polished surface GR_D may be formedas a portion of the first side surface SW1. The second polished patternGP2 may be formed on the lower polished surface GR_D. In an exemplaryembodiment, a length of the second polished pattern GP2 may extend in adirection perpendicular to the rotary shaft R2 or a directionperpendicular to the lower end or the upper end GR_D1 of the lowerpolished surface GR_D.

In the above, although the description has been given of an examplewhere the operation of perpendicularly polishing the upper end of thefirst side surface SW1 of the initial state of the first substrate 500to form the upper polished surface GR_U, and the operation ofperpendicularly polishing the lower end of the first side surface SW1 ofthe initial state of the first substrate 500 to form the lower polishedsurface GR_D are successively performed, both operations may besimultaneously performed in other exemplary embodiments, without beinglimited thereto. As illustrated in FIG. 12, the polishing of the upperend of the first side surface SW1 may be performed by the firstpolishing wheel WH1, and the polishing of the lower end of the firstside surface SW1 may be performed by the second polishing wheel WH2.That is, the polishing of the upper end and the lower end of the firstside surface SW1 may be simultaneously or sequentially performed by thefirst polishing wheel WH1 and the second polishing wheel WH2 that arevertically disposed.

The polishing wheels WH1 and WH2 and the first substrate 500 may bemoved relative to each other for the vertical polishing. That is, asillustrated in FIG. 12, the first substrate 500 may move in the y-axispositive direction (arrow of y in FIG. 12), or the polishing wheels WH1and WH2 may move in the y-axis negative direction (opposite to the arrowof y in FIG. 12). Thus, the upper end or the lower end of the first sidesurface SW1 may be entirely polished.

FIG. 13 illustrates the results of polishing the upper end or the lowerend of the first side surface SW1 shown in FIG. 12.

In an exemplary embodiment, a width W1 of the upper polished surfaceGR_U may be greater than a width W2 of the lower polished surface GR_D.Further, the slope of the upper polished surface GR_U may be smallerthan the slope of the lower polished surface GR_D. In general, thevertical polishing accompanies a decrease in strength of the substrate,and as described above, when the widths and the slopes of the upperpolished surface GR_U and the lower polished surface GR_D asintermediate process surfaces of the first substrate 500 are differentlyformed, it is possible to reduce the damage applied to the top of thefirst substrate 500. The upper polished surface GR_U and the lowerpolished surface GR_D as intermediate process surfaces of the firstsubstrate 500 may be connected to each other at a distal end of thefirst substrate 500, such as by a vertical surface.

Subsequently, referring to FIGS. 14, 15 and 16, the operation ofdiagonally polishing intermediate portions of the first side surface SW1to form the first polished surface GR1 is performed.

As described above, the diagonal polishing may be performed by thesub-machining surface SS of the polishing wheels WH3 and WH4. Whenperforming the diagonal polishing, a portion of the first side surfaceSW1 is cut, and the first side surface SW1 may be located furthertowards an inner area of the first substrate 500 as compared to anoriginal location of the first side surface SW1 (FIG. 12) in an initialstate of the first substrate (FIG. 12).

Specifically, when performing the diagonal polishing, the sub-machiningsurface SS may be made closer to be brought into contact with the firstside surface SW1 and the second side surface SW2 in a state of beingdisposed in parallel to the first side surface SW1 and the second sidesurface SW2. The sub-machining surface SS may rotate in accordance withthe rotation of the rotary shafts R3 and R4, and the diagonal polishedpattern, e.g., the first polished pattern GP1 may be formed on the firstside surface SW1 and the second side surface SW2 by the rotation of thesub-machining surface SS. That is, the first polished pattern GP1 maydefine a length thereof extended to be inclined at a constant angle fromthe lower end or the upper end of the first side surface SW1 (see FIG.8).

When the diagonal polishing is performed on the first side surface SW1,the width W1 of the upper polished surface GR_U may be reduced to widthW3 by cutting or removal of a distal end portion of the first substrate500 by the polishing wheel WH4. Further, an entirety of the lowerpolished surface GR_D may be removed by cutting. That is, a totalcutting length of the first substrate 500 at the first side surface SW1thereof may be equal to or larger than the initial width W2 of the lowerpolished surface GR_D. However, in other exemplary embodiments, aportion of the lower polished surface GR_D may remain. In this case, thefirst side surface SW1 may include three polished surfaces, namely, thefirst polished surface GR1, the second polished surface GR2 and theremaining portion of the lower polished surface GR_D.

When a portion of the upper polished surface GR_U is removed such as bycutting, the remaining portion of the upper polished surface GR_U maybecome the second polished surface GR2 described for a final state ofthe display device according to the invention.

When the diagonal polishing process is finished, as illustrated in FIG.16, the first polished surface GR1 and the second polished surface GR2may collectively form the first side surface SW1 of the final state ofthe display device. Since the first polished surface GR1 and the secondpolished surface GR2 may be substantially identical to those describedin the exemplary embodiments of the display device according to theinvention, the detailed description thereof will not be provided.

While the invention has been particularly illustrated and described withreference to exemplary embodiments thereof, it will be understood bythose of ordinary skill in the art that various changes in form anddetail may be made therein without departing from the spirit and scopeof the invention as defined by the following claims. The exemplaryembodiments should be considered in a descriptive sense only and not forpurposes of limitation.

What is claimed is:
 1. A display device comprising: a first substratedefining a top surface thereof, a bottom surface thereof facing the topsurface, and side surfaces thereof connecting the top and bottomsurfaces to each other, the side surfaces comprising: a first sidesurface comprising: a first patterned surface including a first patternof which a length thereof extends in a diagonal direction in a plan viewof the first patterned surface.
 2. The display device of claim 1,wherein the first side surface further comprises a second patternedsurface which extends obliquely from an upper end of the first patternedsurface, the second patterned surface including a second pattern ofwhich a length thereof extends in a perpendicular direction from theupper end of the first patterned surface in a plan view of the secondpatterned surface.
 3. The display device of claim 1, wherein the sidesurfaces of the first substrate further comprise: a second side surfacewhich faces the first side surface and includes the first pattern ofwhich the length thereof extends in a diagonal direction in a plan viewof the second side surface.
 4. The display device of claim 2, whereinthe first pattern and the second pattern are an embossed pattern or anintaglio pattern.
 5. The display device of claim 2, wherein the firstpatterned surface and the second patterned surface each comprise anoverall uneven surface defined by the first pattern and the secondpattern provided in plural, respectively.
 6. The display device of claim3, wherein the first substrate comprises a display region at which animage of the display device is displayed, and a non-display regiondisposed outside the display region and at which the image of thedisplay device is not displayed.
 7. The display device of claim 6,further comprising: a second substrate which overlaps the display regionof the first substrate and is disposed facing the first substrate. 8.The display device of claim 7, wherein the second substrate defines atop surface thereof, a bottom surface thereof facing the top surface,and side walls thereof connecting the top and bottom surfaces to eachother, the side walls comprising a first side wall, and a second sidewall which faces the first side wall, the first side wall of the secondsubstrate is disposed at a same side of the display device as the firstside surface of the first substrate and on an inner side of the firstside surface in a plan view of the display device, and the second sidewall of the second substrate is disposed at a same side of the displaydevice as the second side surface of the first substrate and is coplanarwith the first side surface.
 9. The display device of claim 8, whereinthe second side wall of the second substrate and the second side surfaceof the first substrate coplanar with each other, each include the firstpattern.
 10. The display device of claim 7, wherein in a top plan viewof the display device, a portion of the top surface of the firstsubstrate is exposed by the second substrate, and the display devicefurther comprises a pad provided in plurality disposed on the exposedportion of the top surface of the first substrate.
 11. The displaydevice of claim 7, further comprising: a thin film transistor disposedon the first substrate, and a color filter disposed on the secondsubstrate.
 12. The display device of claim 1, wherein the first patternis provided in plurality spaced apart from each other, and each of theplurality of first patterns form a first angle with respect to the upperend of the first patterned surface.
 13. The display device of claim 12,wherein the plurality of first patterns comprises with respect to theupper end of the first patterned surface: a first inclined pattern ofwhich a length thereof is extended in a left-to-right diagonaldirection, and a second inclined pattern of which a length thereof isextended in a right-to-left diagonal direction.
 14. The display deviceof claim 12, wherein the first angle is 50 degrees or less.
 15. Thedisplay device of claim 12, wherein distances between the plurality ofthe first patterns are identical to each other.
 16. The display deviceof claim 12, wherein distances between the plurality of the firstpatterns are different from each other.
 17. The display device of claim1, wherein the first substrate is curved.
 18. A display devicecomprising: a first substrate defining a top surface thereof and abottom surface thereof facing each other, and four side surfaces thereofsurrounding outer circumferences of the top and bottom surfaces, whereinthe four side surfaces comprise a first side surface and a second sidewhich faces the first side surface, the first side surface comprising: afirst patterned surface including a first pattern of which a lengththereof extends in a diagonal direction in a plan view of the firstpatterned surface, and a lower edge of the first patterned surfacecontacts the bottom surface.
 19. The display device of claim 18, whereinthe first side surface further comprises a second patterned surfacewhich extends obliquely from an upper end of the first patternedsurface, the second patterned surface including a second pattern ofwhich a length thereof extends in a direction perpendicular to the upperend of the first patterned surface, and an upper edge of the secondpatterned surface contacts the top surface.
 20. A method formanufacturing a display device, the method comprising: preparing a firstsubstrate including a first side surface defined by first and secondpatterned surfaces, and a second substrate which faces the firstsubstrate; and coupling the first and second substrates to each other toform the display device, wherein the preparing the first substratecomprises: providing an initial state of the first substrate defining atop surface thereof, a bottom surface thereof facing the top surface,and connecting surfaces thereof connecting the top and bottom surfacesto each other, forming at a first connecting surface, an upper patternedsurface which is inclined from the top surface, the upper patternedsurface including a second pattern of the second patterned surface, alength of the second pattern extended perpendicular to a length of thefirst connecting surface by perpendicularly polishing an upper end ofthe first connecting surface; forming at the same first connectingsurface, a lower patterned surface which is inclined from the bottomsurface, the lower patterned surface including the second pattern of thesecond patterned surface by perpendicularly polishing a lower end of thefirst connecting surface; and forming the first patterned surface of thefirst substrate which is extended from the bottom surface, by diagonallypolishing the upper and lower patterned surfaces.
 21. The method ofclaim 20, wherein the lower patterned surface is removed by the diagonalpolishing to form the first patterned surface of the first substrate.22. The method of claim 20, wherein the first patterned surface of thefirst substrate includes a first pattern of which a length thereofextends in a diagonal direction in a plan view of the first patternedsurface, by the diagonal polishing.